GBT’s CIP Patent Application of 3D, Multiplanar Photonic Microchips Was Approved for Fast Track

GBT's CIP Patent Application of 3D, Multiplanar Photonic Microchips Was Approved for Fast Track

The CIP (Continuation in Part) patent application protects architecture and manufacturing technologies for Photonic, 3D, Multi-Planar integrated circuit technology

SAN DIEGO, May 01, 2023 (GLOBE NEWSWIRE) — GBT Technologies Inc. ( OTC PINK: GTCH ) (“GBT” or the “Company”), announces that its continuation-in-part (CIP) patent application covering its photonic, 3D, Multi-Planar, integrated circuits design and manufacturing architecture, was approved for Fast Track processing by the United States Patent and Trademark Office. GBT filed for expedited processing to prioritize the photonic CIP application for faster examination, which will allow for a final disposition within approximately twelve months.



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