GBT Technologies Inc. ( OTC PINK: GTCH ) (“GBT” or the “Company”), received a notice of allowance in Korea for its 3D, Multi-Planar IC design and manufacturing technology patent application.
The Korean Patent Application No. is 10-2021-7008024 and it is based on PCT/US2019/050266 application. GBT’s patent application for its 3D, MP microchip architecture presents a new way to design and manufacture integrated circuits to fit advanced analog, digital and mixed-type integrated circuits (“IC”) on a silicon wafer. The company’s first 3D microchip patent was filed on March 5, 2019 and granted as of December 1, 2020, by the United States Patent and Trademark Office (“USPTO”); U.S. Patent No. 10,854,763.
