GBT Technologies Inc, 3D Multi Planar Chip Design Introduction
The Company’s 𝟑𝐃 𝐂𝐡𝐢𝐩 patent seeks to cover new, multiplanar silicon design and manufacturing structure.
The goal of the new manufacturing architecture is to enable larger designs within smaller areas and, in turn, provide for increases in the silicon yield to enhance the surface area, especially for smaller nodes like 5nm, 3nm, and below.
GBT is aiming to protect its 3D, multiplanar chip intellectual property in key countries and continents.
The invention is designed to present a new die structure and orientation with a focus on a deep nanometer range.