Continuation Patent Application Seeks to Further Protect GBT’s original 3D, MP Patent’s Concepts for New Semiconductor Design and Manufacturing Architecture
SAN DIEGO, July 05, 2022 (GLOBE NEWSWIRE) — GBT Technologies Inc. ( OTC PINK: GTCH ) (“GBT” or the “Company”), received a notice of allowance for its 3D, multiplanar continuation patent application, further protecting its innovative integrated circuits design and manufacturing concepts. The Company’s initial 3D microchip patent was filed on March 5, 2019, and was granted as of December 1, 2020 by the United States Patent and Trademark Office (“USPTO”); U.S. Patent No. 10,854,763. The continuation application (#17102928), was filed on November 24, 2020, seeking to broaden the protection of its main IP concepts.
The invention presents a new concept of designing and manufacturing integrated circuits in a 3D, multi-Planar architecture. The invention fits advanced analog, digital and mixed signal IC types. The patent protects distinctive methods to design and manufacture microchip’s within significantly less space, with the goal of increasing their performance and lowering power consumption. Silicon’s “real-estate” is a major a factor for IC’s design, manufacturing, performance, and cost.
The invention enables the utilization of more transistors on a silicon wafer which can be a major advantage for advanced chips that require large amount of device, particularly for memories, CPU, GPU, and AI ICs. This technology can be advantageous for any IC design firms enabling design and manufacturing of advanced microchips with much lower cost, creating new markets and opportunities. GBT’s goal is to further develop advancements in this domain through the use of the 3D, multidimensional design, creating new standards in designing and manufacturing of the next generation ICs.
“This is going to be our second patent for this innovative Multi Planar technology and we plan to further investigate into this domain, with the target to invent new design and manufacturing standards. A Multi Planar microchip means many more circuits on board which will enable gigantic ICs with numerous functionalities. As the industry is constantly demanding more functionalities, faster and with lower cost ICs, we believe this type of architecture can offer a breakthrough solution and become a new standard.
It is the goal of the technology to allow chips that are designed and manufactured using this architecture to occupy significant less silicon space, operate in much faster speed and drastically reduce the overall cost. Along with scaling down ICs size to fit into smaller electronic devices, we believe this will enable a whole new world of possibilities, to create new era ICs for hi-demand arenas like mobile communication, storage, AI and processing power. The 3D microchip continuation patent application is aiming to strengthen the original patent with innovative design and fabrication concepts. With the ever growing complexity of microchips, demand for higher performance, and smaller size, we believe that the patent’s technology can become a standard in the upcoming years, enabling powerful, and much more economical, IC’s projects,” stated Danny Rittman, the Company’s CTO.
GBT Technologies, Inc. (OTC PINK: GTCH) (“GBT”) ( https://gbtti.com ) is a development stage company which considers itself a native of Internet of Things (IoT), Artificial Intelligence (AI) and Enabled Mobile Technology Platforms used to increase IC performance. GBT has assembled a team with extensive technology expertise and is building an intellectual property portfolio consisting of many patents. GBT’s mission, to license the technology and IP to synergetic partners in the areas of hardware and software. Once commercialized, it is GBT’s goal to have a suite of products including smart microchips, AI, encryption, Blockchain, IC design, mobile security applications, database management protocols, with tracking and supporting cloud software (without the need for GPS).
GBT envisions this system as a creation of a global mesh network using advanced nodes and super performing new generation IC technology. The core of the system will be its advanced microchip technology; technology that can be installed in any mobile or fixed device worldwide. GBT’s vision is to produce this system as a low cost, secure, private-mesh-network between all enabled devices. Thus, providing shared processing, advanced mobile database management and sharing while using these enhanced mobile features as an alternative to traditional carrier services.
Certain statements contained in this press release may constitute “forward-looking statements”. Forward-looking statements provide current expectations of future events based on certain assumptions and include any statement that does not directly relate to any historical or current fact. Actual results may differ materially from those indicated by such forward-looking statements because of various important factors as disclosed in our filings with the Securities and Exchange Commission located at their website ( http://www.sec.gov ). In addition to these factors, actual future performance, outcomes, and results may differ materially because of more general factors including (without limitation) general industry and market conditions and growth rates, economic conditions, governmental and public policy changes, the Company’s ability to raise capital on acceptable terms, if at all, the Company’s successful development of its products and the integration into its existing products and the commercial acceptance of the Company’s products.
The forward-looking statements included in this press release represent the Company’s views as of the date of this press release and these views could change. However, while the Company may elect to update these forward-looking statements at some point in the future, the Company specifically disclaims any obligation to do so.These forward-looking statements should not be relied upon as representing the Company’s views as of any date subsequent to the date of the press release.
Dr. Danny Rittman, CTO
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