Enhancing the 3D Microchip Using Architecture Adjustments

Enhancing the 3D Microchip Using Architecture Adjustments

With the hope to maintain efficiency, the ongoing problem with 3D chips is that they rely on traditional interconnectivity methods, including wire bonding and flip chips, to stack vertically. By trying to create a 3D integrated circuit, the stacking of the silicon wafers develops limitations.

Redesigning the microchip architecture can improve production like routing and the placement of critical building blocks within the IC. One method found to help make these improvements in the architecture of the microchip includes changing the design from the stereotypical flat (or two-dimensional design) to a 3D or layered structure.

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